Products
Pick & Taping Machine
Picking up diced WLCSP directly from a wafer. Then inserting it into an embossed tape after visual inspection and selection.
Applications
| Target | WLCSP,CSP |
|---|---|
| Chip | 0.5-8.0ｍｍ |
| Wafer | 6 inch, 8 inch (12 inch wafer currently under development.) |
Specification
| Cycle time |
0.25sc/cycle actual production speed will depend on the conditions, of the chips, visual inspection, etc. |
|---|---|
| Supply system | waferring magazine |
| magazine (25) | |
| Positioning | Image recognition |
| Reel size | Supplying reel 600 mm |
| Collecting reel 180 & 330mm (EIAJ product) | |
| Cover tapes outer diameter 210mm, inner diameter 3inches (EIAJ product) | |
| Visual inspection | Inmark (NG mark), bump, chipping, marking |
| Kinds | Taping, Box (2spec), Tray(option) |
| Outside dimensions | 1180(w) * 1690(h)mm(except warning light) |
| Weight | 1,300kg |
| Color | Standard (the color can be specified optionly) |
| Control | Composed of an automated control box, a control panel, and a manual control box. |
Option
| 1. | mapping |
|---|---|
| 2. | Ring to Tray |
| 3. | Ring to Tape |
| 4. | Ring to Tray / Ring to Tape Combined |
Power sources
| Power supply | AC200V 3phase 50/60Hz |
|---|---|
| Air | 0.5MPa or more |
| Source of vacuum | an internal vacuum pump |
Products
List
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Hi-MECHA CORPORATION
kubota 2534-6, kubota-machi, yonezawa-shi, yamagata-ken
992-0003, Japan
TEL:+81-238-37-2905
FAX:+81-238-37-2904